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Win. CE- BSP ARM- A8 User Guide - Texas Instruments Wiki. Introduction. Contents of this guide have been updated to include Release 2. Users of earlier releases can still use this guide but support for new platforms (AM3. AM3. 35x) is only available in Release 2.

This document provides information for the user of the Microsoft® Windows® Embedded CE 6. R3 BSP (BSP) or the Microsoft® Windows® Embedded Compact 7 BSP (BSP) for the Texas Instruments OMAPTM3. Evaluation Module (EVM), AM3. Evaluation Module (EVM), AM3.

EVM and AM3. 35x General Purpose EVM. This combined offering is referred as "TI ARM_A8 BSP" in this document. Instructions are provided for installing the BSP, building images and loading images onto the EVM. Requirements. There are many requirements for software, hardware, infrastructure and user experience level that should be met prior to working with EVM BSP and Windows CE. Required Experience. This document is not intended for novice Windows CE users. Readers unfamiliar with Windows CE are encouraged to seek training and to study the documentation included with Windows CE before using the TI_ARM_A8 BSP and related documentation.

Required Software. The following software must be installed prior to installing the TI ARM_A8 BSP. Note that the software must be installed in the order listed. Contact Microsoft for more information about the listed software and known issues with the installation process. Visual Studio 2. 00. VS2. 00. 5) Visual Studio SP1 (Service Pack 1) Windows Embedded CE 6.

Plug In for Visual Studio 2. Windows CE 6. 0 SP1 (Service Pack 1) Windows CE 6. R2 Update Windows CE 6. Cumulative Product Update Rollup Package 2. QFEs) Windows CE 6. QFEs through November 2.

Users new to Windows Embedded CE6 can obtain evaluation versions of the required software from Microsoft http: //msdn. For BSP 2. x. Microsoft Visual Studio 2. Professional Edition. Microsoft Visual Studio 2. Professional Service Pack 1. Windows Embedded Compact 7. Windows Embedded Compact 7 Updates - update 1 to update 4 (Oct 2.

Required JTAG Tools. There are no JTAG tools required for use with above mentioned EVMs.

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Texas Instruments provides a tool that can be used to communicate with the internal boot ROM on the OMAP3. This tool can be used to program the bootloader into the EVM if there is no functional bootloader available.

Required Network Capabilities. The EVM supports communications with the development PC running Platform Builder using either Ethernet or USB RNDIS. Platform Builder requires the device to be on the same subnet as the development PC. The bootloader and kernel support both manual and dynamic IP address assignment. DHCP is enabled by default; this can be changed using the bootloader menu.

Notation Conventions. The following section describes terms used in this document. CPU Name This document is written to support a number of EVMs mentioned above. The term OMAP3. 5xx will be used to indicate one of the CPU names (OMAP3.

AM/DM3. 7x family) supported by the OMAP3. EVM; AM3. 5xx, AM3. AM3. 35x will be used to indicate one of the CPU names supported by their respective EVMs. When working with a particular CPU type, the term OMAP3. CPU. CPU family. EVMSupported CPU name OMAP3. OMAP3. 50. 3/3. 51.

DM3. 73. 0/3. 72. AM3. 71. 5/3. 70. Watch The Bet Online Facebook. AM3. 87x EVM (Baseboard only).

AM3. 35x EVM (General Purpose, Profile 0). BSP Folder This document is written to support the following EVMs: The BSP folders for these EVMs are as follows. OMAP3. 5x EVM: platform/EVM_OMAP3. Savage Weekend Full Movie on this page. AM3. 5x EVM: platform/AM3.

X_BSPAM3. 87x EVM: platform/AM3. BSPAM3. 35x EVM: platform/AM3. BSPIn this document, the term BSP Folder will be used to refer to one of the above folders depending upon the context. TI EVM When not explicitly specified, TI EVM refers to any of the above mentioned EVMs. OMAP3. 5xx EVM also includes support for AM3.

DM3. 7x processor family. WINCE OS When not explicitly specified, this content applies to both Win. CE 6. 0 R3 and WEC 7.

For demonstration purposes, CE6 examples may be used. Unless otherwise specified in that section, similar principles apply for WEC 7 for those examples. Please use ARMV7 for CE7 and ARMV4. I for CE6. When version number is not explicity mentioned, then 'Windows Embedded CE' and 'Win. CE' terms refer to both Win.

CE 6. 0 and WEC 7 in this document. When version number is not explicity mentioned, then 'Visual Studio' and 'VS' terms refer to both VS2. VS2. 00. 8 in this document. BSP Version BSP 1.

Windows Embedded CE 6. BSP 2. x releases are based on Windows Embedded Compact 7.

Other Terms Knowledge of Visual Studio, Platform Builder and Windows Embedded CE terms is assumed. The user should consult Platform Builder documentation for a definition of any unfamiliar terms. Related Documentation. This section describes other documentation that should be referenced when working with the TI ARM_A8 BSP.

Visual Studio / Platform Builder Documentation This documentation is the primary reference material for understanding the Windows Embedded CE development system. Familiarity with this material is essential to successful Windows CE development using the EVM. EVM Board Schematics Schematics for the EVMs are included as part of the platform documentation.

BSP Features. This chapter discusses features of the TI ARM_A8 BSP. Bootloader (EBOOT)Bootloader and Initialization Sequence. The TI EVM board boots from Flash memory using the internal boot ROM of the TI ARM_A8 processor. The bootloader architecture consists of an initial bootstrap loader called the XLDR and a secondary loader called EBOOT.

The internal boot ROM performs a minimum hardware setup, and then copies the XLDR from the first good block of Flash memory to a fixed location in internal SRAM. The boot ROM then jumps to the entry point of the XLDR. The XLDR is a BSP specific bootstrap loader whose function is to do basic hardware initialization and copy the second stage, full featured EBOOT from Flash memory into RAM for execution. The XLDRsize is limited by the size of internal SRAM and does not implement any features other than what are needed for bootstrap. Note: the BSP only builds the XLDR in Release configurations. Debug configurations use un- optimized code libraries that cause the XLDR to exceed the allotted size.

The primary development bootloader is called EBOOT. The primary purpose of the EBOOT loader is to load the operating system image from a specified source and launch it. EBOOT also provides a serial based user interface that allows a developer to control various aspects of the loader behavior. Low Level Initialization.

Low level hardware initialization is performed in the XLDR as part of its bootstrap requirements. This includes multifunction pin configuration, clock setup, chip select timings, and DDR configuration. The file. SRC\BOOTLOADER\XLDR\platform. This file must be modified for every hardware platform. The \INC directory contains a number of header files with defines that control many of the timing and memory map related initialization parameters.

Device Configuration Parameters. The bootloader provides user accessible configuration parameters that control various aspects of bootloader behavior. These parameters are primarily used during development to control where the OS image comes from, network configuration etc. Changes to the configuration parameters can optionally be saved to nonvolatile storage (Flash memory) and preserved across power cycles. The configuration parameters can be accessed by the user via the serial user interface. For BSP 2. x releases, the configuration parameters can be saved and retrieved from flash even for SD bootloader. For AM3. 35. X and AM3.

X, instead of saving to NAND flash, you can select to save the configuration parameters to a binary file on SD card (eboot. BSP_SAVE_EBOOTCFG_TO_SD in environment variable.

This option is only available for SD bootloader. Serial User Interface. EBOOT supports a user interface over the serial port exposed on the TI EVMs as shown in the following table through a RS2. EVMDebug port on EVMCPU UART OMAP3.